High-Speed Copper Clad Laminate

High-speed copper clad laminate (HS-CCL) is a PCB substrate specifically engineered for high-frequency signal transmission. It effectively reduces delays and losses during the signal transmission process, thereby enhancing data transfer rates and maintaining signal integrity.

 

HS-CCL is characterized by its low dielectric constant (D_k) and low dielectric loss factor (D_f). The premium fillers from Ginet, such as fused silica, deflagration silica and chemical silica, are capable of meeting the electrical performance requirements for various grades of HSCCL, ensuring the stability and reliability of electronic products.

 

 

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High-Frequency Copper Clad Laminate

High-frequency copper clad laminate  (HF-CCL) is specifically engineered for high-frequency signal transmission and radio frequency applications, making them a critical material in the electronics industry, particularly within the fields of telecommunications, aerospace, radar, and satellite navigation. These laminates exhibit various dielectric constants and low dielectric loss characteristics.

 

Ginet's offerings, including flame silica, chemical silica, hollow silica, and titanium oxide, provide a range of powder solutions tailored to meet the demands of different dielectric constants and low loss, facilitating applications in radar, antennas, and RF technologies.

 

 

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IC Carrier Board

The IC carrier board, also known as a packaging substrate, is an essential key material in the semiconductor packaging sector, with extensive applications. IC carrier boards are characterized by high density, precision, performance, miniaturization, and thin profiles. Ginet's deflagration silica and chemical silica can all meet the high performance and reliability requirements of these carrier boards.

 

 

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FR4 Copper Clad Laminate

FR4 copper clad laminate  (FR4-CCL) is one of the most widely used materials in electronic manufacturing. It features excellent heat resistance, dimensional stability, and low moisture absorption.

 

Ginet's composite silica and crystalline silica are extensively utilized in FR4 copper clad laminates, addressing the electronic industry's needs regarding material performance, cost control, and production efficiency.

 

 

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Aluminum Substrate

Aluminum substrate, recognized as high-performance thermal management materials, finds extensive applications in LED lighting, power electronics, and communication devices. They possess characteristics such as high thermal conductivity and voltage resistance. Ginet can provide various specifications of alumina and boron nitride to meet the demands for efficient thermal dissipation, lightweight designs, and high comparative tracking index (CTI) in aluminum substrate applications.

 

 

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Ink used for PCBs

The ink used for PCBs is a critical material specifically designed for the manufacturing process of PCBs. It primarily serves to create conductive pathways, solder mask layers, and character markings on copper-clad substrates. This type of ink is distinguished by high resolution, excellent adhesion, chemical resistance, thermal stability, and environmental durability. The fillers utilized by Ginet include crystalline quartz, fused quartz, boron nitride and boehmite, each possessing unique performance characteristics suitable for various types and applications of ink.