Recently, our company officially joined the China Semiconductor Industry Association, which marks the widespread recognition of our key enterprise qualifications in the semiconductor industry.

The company is committed to enhancing its research and development innovation capabilities, deeply cultivating fields such as TGV, TCV, IC board interconnection, LED solidification, and chip bonding/module bonding. It provides high, medium, and low-temperature sintered copper paste, silver paste, and low-temperature cured copper paste for semiconductor customers, meeting the urgent demand for high-performance products in the market.