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Summary
It is manufactured through multiple processes including high-temperature melting, spheroidization, ultrafine classification, and surface treatment of high-purity quartz powder.
Feature
High purity, high sphericity, excellent fluidity, and a high filling rate; good dielectric properties, favorable fluidity, and low thermal expansion coefficient.
Function
High-speed and high-frequency copper-clad laminate, solid state encapsulant, plastic opening agent, electronic ink, powdered coating.
| Q Series | ||||
| Typical Physical Data | Test Item | Unit | Typical Value | Test Method |
| D50 | μm | 2.5~21 | Laser PSA | |
| D99 | μm | 6~81 | ||
| Spheroidization rate | % | 85~95 | SEM | |
| tanδ | —— | 0.0006~0.0012 | Paraffin Compression Method | |
| CTE | ppm/℃ | 0.5 | Theoretical Value | |
| Typical Chemical Data | SiO2 | % | 99-99.7 | XRF |
Summary
It is manufactured through multiple processes including high-temperature melting, spheroidization, ultrafine classification, and surface treatment of high-purity quartz powder.
Feature
High purity, high sphericity, excellent fluidity, and a high filling rate; good dielectric properties, favorable fluidity, and low thermal expansion coefficient.
Function
High-speed and high-frequency copper-clad laminate, solid state encapsulant, plastic opening agent, electronic ink, powdered coating.
| Q Series | ||||
| Typical Physical Data | Test Item | Unit | Typical Value | Test Method |
| D50 | μm | 2.5~21 | Laser PSA | |
| D99 | μm | 6~81 | ||
| Spheroidization rate | % | 85~95 | SEM | |
| tanδ | —— | 0.0006~0.0012 | Paraffin Compression Method | |
| CTE | ppm/℃ | 0.5 | Theoretical Value | |
| Typical Chemical Data | SiO2 | % | 99-99.7 | XRF |