Summary

Manufactured through various processes including chemical synthesis, surface treatment, and ultrafine classification.

Feature

High purity, narrow particle size distribution, high sphericity, and excellent fluidity; superior dielectric performance, low thermal expansion coefficient, and small specific surface area, make it particularly suitable for M6 grade and above high-frequency, high-speed copper-clad laminates; monodisperse uniform particle that are more easily bonded with resin after surface treatment.

Function

High-speed and high-frequency copper-clad laminate, liquid encapsulant material, BT substrate, IC substrate, and BF material.