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Conductive Paste
High-Temperature Sintered Copper Paste
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Sintered Copper Paste-
Sintered Copper Paste
2025-05-08
Summary High-temperature sintered copper paste that can be used for printing on the electrode portion of a component. Feature Can be sintered at low temperatures of 700℃ and 750℃; excellent end densification, suitable for plating, good acid corrosion...
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Curing Copper Paste-
Curing Copper Paste
2025-05-08
Summary It can be used to make lines for flexible and rigid boards. Feature Not easy to ionic migration, stable conductivity of printed lines; viscosity can be adjusted according to customer requirements, suitable for printing; 150 ℃ atmospheric curi...
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