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Low-Temperature Curing Copper Paste
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Curing Copper Paste
Summary
It can be used to make lines for flexible and rigid boards.
Feature
Not easy to ionic migration, stable conductivity of printed lines; viscosity can be adjusted according to customer requirements, suitable for printing; 150 ℃ atmospheric curing, no need for reducing atmosphere protection.
Function
Electronic ceramic, membrane switche, PCB plugging paste, MLCC end paste.
Summary
It can be used to make lines for flexible and rigid boards.
Feature
Not easy to ionic migration, stable conductivity of printed lines; viscosity can be adjusted according to customer requirements, suitable for printing; 150 ℃ atmospheric curing, no need for reducing atmosphere protection.
Function
Electronic ceramic, membrane switche, PCB plugging paste, MLCC end paste.
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